军工集成电路芯片粘接用导电银胶JM7000
军工集成电路芯片粘接用导电银胶JM7000
LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die
sizes up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.
军工集成电路芯片粘接用导电银胶JM7000
LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die
sizes up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.
军工集成电路芯片粘接用导电银胶JM7000
